Foundry reports step change in superconducting qubit yield
A shift in junction fabrication tightens the frequency spread that has plagued multi-chip modules.
By Miko Halvorsen
Written in-house by the Company briefing desk — an explainer, not a report of a news event.
- Junction frequency spread narrowed substantially wafer-to-wafer.
- Fewer collisions means less post-fabrication trimming.
- Third-party access to the process is promised for next year.
Superconducting qubits are made by hand-tuned processes at a scale where small deviations dominate. Junction resistance spread translates directly into qubit frequency spread, and frequency collisions kill multi-qubit devices.
The foundry says a revised junction process narrowed that spread enough to cut post-fabrication trimming dramatically, improving usable yield per wafer.
External access to the process is promised for next year — the detail that matters most to academic groups without in-house fabrication.
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